Home  >   Technology  >   Bottom Fill
Bottom Fill
Even if subjected to extreme external shock or vibration, remains unaffected and stable operation

SiliconGo storage products utilize bottom-fill technology to provide a tighter electrical connection between the chip and the PCB to resist extreme external shocks and vibrations, while enhancing the toughness of the components to ensure that they will not fall off due to thermal expansion and contraction at high temperatures, greatly improving the stability of the product.

得一微微信公众号
扫描二维码，关注得一微